AbstractCopper thin films of 80-nm thickness were deposited on glass substrate using electron beam deposition at two different deposition angles of 0° and 40°, and they were post-annealed under flow of nitrogen at different temperatures. The structure of the films was analyzed using X-ray diffraction, atomic force microscope, and scanning electron microscope. Investigation on the […]
AbstractA 2.2-kJ Mather type plasma focus device charged at 18 kV was used to deposit titanium nitride on 304 type stainless steel substrates. The plasma focus device is fitted with solid titanium anode and operated with nitrogen as the filling gas. The process of deposition was done at room temperature, and samples were deposited at […]
