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<ArticleSet>
<Article>
<Journal>
<PublisherName>OICC Press</PublisherName>
<JournalTitle>Journal of Nanostructure in Chemistry</JournalTitle>
<Issn>2193-8865</Issn>
<Volume>11</Volume>
<Issue>3 (September 2021)</Issue>
<PubDate PubStatus="epublish">
<Year>2021</Year>
<Month>07</Month>
<Day>31</Day>
</PubDate>
</Journal>
<ArticleTitle>Recent progress for silver nanowires conducting film for flexible electronics</ArticleTitle>
<VernacularTitle></VernacularTitle>
<FirstPage></FirstPage>
<LastPage></LastPage>
<ELocationID EIdType="doi">10.1007/s40097-021-00436-3</ELocationID>
<Language>EN</Language>
<AuthorList>
<Author>
<FirstName>Lu</FirstName>
<LastName>Zhang</LastName>
<Affiliation>College of Chemistry, Chemical Engineering and Resource Utilization, Northeast Forestry University, Harbin, 150040, CN</Affiliation>
<Identifier Source="ORCID"></Identifier>
</Author>
<Author>
<FirstName>Tingting</FirstName>
<LastName>Song</LastName>
<Affiliation>College of Chemistry, Chemical Engineering and Resource Utilization, Northeast Forestry University, Harbin, 150040, CN</Affiliation>
<Identifier Source="ORCID"></Identifier>
</Author>
<Author>
<FirstName>Lianxu</FirstName>
<LastName>Shi</LastName>
<Affiliation>College of Chemistry, Chemical Engineering and Resource Utilization, Northeast Forestry University, Harbin, 150040, CN</Affiliation>
<Identifier Source="ORCID"></Identifier>
</Author>
<Author>
<FirstName>Nan</FirstName>
<LastName>Wen</LastName>
<Affiliation></Affiliation>
<Identifier Source="ORCID"></Identifier>
</Author>
<Author>
<FirstName>Zijian</FirstName>
<LastName>Wu</LastName>
<Affiliation>Key Laboratory of Engineering Dielectrics and Its Application, Ministry of Education, Harbin University of Science and Technology, Harbin, 150040, CN</Affiliation>
<Identifier Source="ORCID"></Identifier>
</Author>
<Author>
<FirstName>Caiying</FirstName>
<LastName>Sun</LastName>
<Affiliation>College of Chemistry, Chemical Engineering and Resource Utilization, Northeast Forestry University, Harbin, 150040, CN</Affiliation>
<Identifier Source="ORCID"></Identifier>
</Author>
<Author>
<FirstName>Dawei</FirstName>
<LastName>Jiang</LastName>
<Affiliation>College of Chemistry, Chemical Engineering and Resource Utilization, Northeast Forestry University, Harbin, 150040, CN</Affiliation>
<Identifier Source="ORCID"></Identifier>
</Author>
<Author>
<FirstName>Zhanhu</FirstName>
<LastName>Guo</LastName>
<Affiliation>Dept Chem Engn, Integrated Composites Lab ICL, University of Tennessee System University of Tennessee Knoxville Univ Tennessee, Knoxville, TN, 37996, US</Affiliation>
<Identifier Source="ORCID"></Identifier>
</Author>
</AuthorList>
<PublicationType>Journal Article</PublicationType>
<History>
<PubDate PubStatus="received">
<Year>2021</Year>
<Month>07</Month>
<Day>31</Day>
</PubDate>
</History>
<Abstract>Abstract
Silver nanowires (AgNWs), as one-dimensional nanometallic materials, have attracted wide attention due to the excellent electrical conductivity, transparency and flexibility, especially in flexible and stretchable electronics. However, the microscopic discontinuities require AgNWs be attached to some carrier for practical applications. Relative to the preparation method, how to integrate AgNWs into the flexible matrix is particularly important. In recent years, plenty of papers have been published on the preparation of conductors based on AgNWs, including printing techniques, coating techniques, vacuum filtration techniques, template-assisted assembly techniques, electrospinning techniques and gelating techniques. The aim of this review is to discuss different assembly method of AgNW-based conducting film and their advantages.
Graphic abstract
Conducting films based on silver nanowires (AgNWs) have been reviewed with a focus on their assembly and their advantages.

</Abstract>
<ObjectList>
<Object Type="keyword">
<Param Name="value">Silver nanowires conducting filns</Param>
</Object>
<Object Type="keyword">
<Param Name="value">Flexible electronics</Param>
</Object>
<Object Type="keyword">
<Param Name="value">Printed electronics</Param>
</Object>
<Object Type="keyword">
<Param Name="value">Electronic industry</Param>
</Object>
</ObjectList>
</Article>
</ArticleSet>